The main steps of the PCBA processing process are as follows:

The first step is raw material preparation, including PCB board procurement, component procurement, quality inspection, and material preparation. The importance of this step lies in providing a solid foundation for subsequent processes.

The second step is SMT mounting.

Step 3, DIP plugin.

Step 4, welding. Fix the PCB board that has completed SMT mounting and DIP plug-in through welding technology. Welding methods include manual welding, wave soldering, hot air soldering, etc.

Step 5, testing. Conduct functional and reliability testing on the PCBA board that has already been welded to ensure that its quality and performance meet the requirements.

The final step is packaging. Package and label the tested PCBA board for use and transportation in the subsequent process.

The significance of PCBA processing lies in providing high-quality and reliable electronic product assembly services. It provides an efficient, precise, and large-scale production method for the manufacturing industry. Through standardized processing processes, electronic product assembly can be faster, more controllable, and traceable, significantly improving production efficiency and product quality.

The PCBA processing flow is the process of accurately installing electronic components on PCB boards that have already been wired, and fixing them through welding and other processes to complete the assembly of electronic products. The significance of PCBS processing is to provide high-quality and reliable electronic product assembly services, providing an efficient, precise, and large-scale production method for the PCBA manufacturing industry.

 

Below, we will introduce the common professional terms used in the processing of PCBA production process one by one.

 

1.PCBA

PCBA stands for Printed Circuit Board Assembly, which refers to the process of processing and manufacturing a PCB board through SMT mounting, DIP plugins, functional testing, and finished product assembly.

 

 

 

 

2. PCB board

PCB is the abbreviation for "Printed Circuit Board", which usually refers to a circuit board. It is usually divided into single panel, double-sided board, and multi-layer board. Common materials include FR-4, resin, fiberglass cloth, and aluminum substrate.

 

3. Gerber files

The Gerber file mainly describes the collection of document formats for drilling and milling data of circuit board images (circuit layer, solder mask layer, character layer, etc.). When conducting PCBA quotations, the Gerber file needs to be provided to the PCBA processing plant.

4. BOM list

The BOM list is a list of materials, which includes all the materials used in PCBA processing, their usage, process flow, etc. It is an important basis for material procurement. When quoting PCBA, it is necessary to calculate the cost unit price of the materials.

5.SMT

SMT stands for Surface Mounted Technology, which refers to the process of solder paste printing, chip mounted device mounting, and reflow soldering on a PCB board.

 

 

 

 

 

 

6. Solder paste printing

Solder paste printing is the process of placing solder paste on a steel mesh, using a scraper to brush the solder paste through the holes on the steel mesh, and accurately printing it onto the PCB pad.

7.SPI

SPI, also known as solder paste thickness detector, needs to undergo SIP testing after solder paste printing, which can detect the situation of solder paste printing and control the printing effect.

8. Reflow soldering

Reflow soldering is the process of sending a pre installed PCB board into a reflow soldering machine, where the high temperature inside causes the paste like solder paste to be heated and turn into a liquid. Finally, it cools and solidifies to complete the soldering process.

 

9.AOI

AOI stands for automatic optical detection, which can detect the welding effect of PCB boards through scanning and comparison, and detect defects in the PCB boards.

10. Repair

The action of repairing defective boards detected by AOI or manual inspection.

11.DIP

DIP is the abbreviation for "Dual In line Package", which refers to the process of inserting components with pins onto a PCB board, and then processing them through wave soldering, trimming, post soldering, and board washing.

 

12. Wave soldering

Wave soldering is the process of sending a PCB board with electronic components inserted into a wave soldering furnace, and completing the welding of electronic materials on the PCB board through processes such as spraying flux, preheating, wave soldering, and cooling.

13. Cutting feet

Trim the pins of the components on the soldered PCB board to achieve the appropriate size.

14. Post welding processing

Post welding processing is the process of repairing PCB boards that have not been fully soldered after inspection.

15. Plate washing

Washing the board is the process of cleaning harmful substances such as flux remaining on the finished PCBA product to achieve the cleanliness required by the customer.

16. Three proof paint spraying

Three proof paint spraying is a special coating applied to the cost board of PCBA. After curing, it can provide insulation, moisture resistance, leakage resistance, shock resistance, dust prevention, corrosion resistance, aging resistance, mold resistance, anti loosening of parts, and insulation resistance to corona. It can extend the storage time of PCBA, isolate external erosion and pollution.

 

 

 

 

 

17. Pads

A solder pad is an area on the surface of a PCB board where local leads are widened and not covered by insulating paint, used for soldering components.

18. Packaging

Packaging refers to a packaging method for electronic components, which is mainly divided into two types: DIP dual inline and SMD chip packaging.

19. Pin spacing

Pin spacing refers to the distance between the centerline of adjacent pins in a mounted component.

20.QFP

QFP, short for Quad flat pack, refers to a surface assembled integrated circuit in a plastic thin package with wing shaped short leads on all sides.

21.BGA

BGA stands for Ball grid array, which refers to integrated circuit devices where the leads of the device are arranged in a spherical grid shape on the bottom surface of the package.

22.QA

QA stands for Quality Assurance, which refers to quality assurance. In PCBA processing, it represents quality inspection.

 

23. Air welding

There is no tin between the pins of the components and the solder pads, or it is due to other reasons that the soldering is not in place.

24. False welding

The amount of tin between component pins and solder pads is too low, lower than the soldering standard.

25. Cold welding

After the solder paste solidifies, there are fuzzy particle attachments on the solder pads, which do not meet the welding standards.

26. Wrong parts

Due to BOM, ECN errors, or other reasons, the position of the components is incorrect.

27. Missing parts

If the parts that should be soldered are not soldered, it is called missing parts.

28. Tin slag and tin balls

After welding, there are excess tin slag and balls on the surface of the PCB board.

29. ICT testing

Detect the open circuit, short circuit, and soldering of all components of PCBA by testing the contact points of the probe. It has the characteristics of simple operation, fast and fast operation, and accurate fault location.

30. FCT testing

FCT testing is commonly known as functional testing, which simulates the operating environment to keep the PCBA in various design states during operation, and obtains parameters from each state to verify the functionality of the PCBA.

31. Aging test

Aging testing is a simulation of the impact of various factors that may occur in the actual use conditions of a product on PCBA.

 

32. Vibration testing

Vibration testing is a test that simulates the vibration resistance of components, components, and complete products in the usage environment, transportation process, and installation process. It is used to determine whether the product can withstand various environmental vibrations.