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Layers: 2L
Product size: 200*310*2.0mm
Material: FR-4 S1000H
Board Thicknes: 0.8 mm
Copper Thicknes: 35/18/18/35 um
Min.Trace/Space: 3/3 mil
Min.Hole Size: 0.22mm
Surface Finsh: ENIG
Main factures:
1.provide flexible production
2.from prototype to mass production
3.support many types of products
4.offer more competitive price
Features
Polyimide substrate: Provides excellent thermal and chemical resistance for high-performance electronic applications.
Multi-layer circuit design: Enhances the complexity and stability of the circuit and is suitable for high-performance communication equipment.
Fine circuit technology: achieve fine circuits and compact space layout to adapt to small-sized electronic components.
High reliability: Strict quality control process ensures the reliability and durability of each circuit board.
Customized services: Provide customized circuit design and manufacturing services according to customers' specific needs
Layers: 2L
Product size: 200*310*2.0mm
Material: FR-4 S1000H
Board Thicknes: 0.8 mm
Copper Thicknes: 35/18/18/35 um
Min.Trace/Space: 3/3 mil
Min.Hole Size: 0.22mm
Surface Finsh: ENIG
Main factures:
1.provide flexible production
2.from prototype to mass production
3.support many types of products
4.offer more competitive price
Features
Polyimide substrate: Provides excellent thermal and chemical resistance for high-performance electronic applications.
Multi-layer circuit design: Enhances the complexity and stability of the circuit and is suitable for high-performance communication equipment.
Fine circuit technology: achieve fine circuits and compact space layout to adapt to small-sized electronic components.
High reliability: Strict quality control process ensures the reliability and durability of each circuit board.
Customized services: Provide customized circuit design and manufacturing services according to customers' specific needs
