Premium Multilayer PCB Development Board Hot Swap Keyboard And BLDC Ceiling Fan Controller Board Kits

• Layers: 2L
  

• Product size: 500*660*2.4mm

• Material: TU-872HF

• Board Thicknes: 1mm

• Copper Thicknes: 1.4mm±0.1mm

• Line/Space: 2.7/2.7mil

• Smallest Hole Diameter: 0.16mm

• Surface Finsh: ENIG

DIP Mass Production Line (Wave Soldering)  Equipment track width adjustment: 510mm  Production Max welding temperature: 330 ℃  PCB transmission speed: 0.2~10m/min  PCB positioning accuracy: ± 0.2mm  Welding positioning accuracy: ± 0.15mm  Heating time of tin furnace: 75min (temperature 280 ℃)